Please use this identifier to cite or link to this item: http://hdl.handle.net/123456789/1093
Title: Dielectric, thermal, and mechanical properties of CeO2-filled HDPE composites for microwave substrate applications
Authors: Anjana, P S
Deepu, V
Uma, S
Mohanan, P
Philip, J
Sebastian, M T
Keywords: Epoxy-resin
Conductivity
Ceramic composites
Elastic-modulus
Expansion coefficients
Composites
Dielectric properties
Mechanical properties
Microstructure
Polyethylene (PE)
Thermal properties
Filled polymer composites
Photopyroelectric technique
Issue Date: 2010
Publisher: Wiley
Citation: Journal of Polymer Science Part B-Polymer Physics 48(9):998-1008;01 May 2010
Abstract: Cerium oxide-filled high density polyethylene (HDPE) composites for microwave substrate applications were prepared by sigma-blend technique. The HDPE was used as the matrix and the dispersion of CeO2 in the composite was varied up to 0.5 by volume fraction, and the dielectric properties were studied at 1 MHz and microwave frequencies. The variations of thermal conductivity (k(eff)), coefficient of thermal expansion (alpha(c)) and Vicker's microhardness with the volume fraction of the filler were also measured. The relative permittivity (epsilon(eff)) and dielectric loss (tan delta) were found to increase with increase in CeO2 content. For 0.4 volume fraction loading of the ceramic, the composite had epsilon(eff) = 5.7, tan delta = 0.0068 (at 7 GHz), k(eff) = 2.6 W/m degrees C, alpha(c) = 98.5 ppm/degrees C, Vicker's microhardness of 18 kg/mm(2) and tensile strength of 14.6 MPa. Different theoretical approaches have been used to predict the effective permittivity, thermal conductivity, and coefficient of thermal expansion of composite systems and the results were compared with the experimental data.
URI: http://ir.niist.res.in:8080/jspui/handle/123456789/1093
ISSN: 0887-6266
Appears in Collections:2010

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