Please use this identifier to cite or link to this item:
http://localhost:8080/xmlui/handle/123456789/1718
Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jobin Varghese | - |
dc.contributor.author | Surendran, K P | - |
dc.contributor.author | Sebastian, M T | - |
dc.date.accessioned | 2014-11-26T05:24:32Z | - |
dc.date.available | 2014-11-26T05:24:32Z | - |
dc.date.issued | 2014 | - |
dc.identifier.citation | RSC Advances 4(88):47701-47707;2014 | en_US |
dc.identifier.issn | 2046-2069 | - |
dc.identifier.uri | http://ir.niist.res.in:8080/jspui/handle/123456789/1718 | - |
dc.description.abstract | A facile formulation of room temperature curable silica ink screen printed on flexible and rigid substrate for printed electronic applications is presented. The colloidal stability and room temperature curability of the developed ink is controlled by optimizing the solvent, filler, dispersant and binder compositions. The printed ink has a porous microstructure with average surface roughness of 370 nm, and dielectric characterization of printed silica ink on BoPET film reveals relative permittivity (epsilon(r)) of 3.2 and dielectric loss (tan delta) of 0.02 at 1 MHz, and values of the above parameters at microwave frequencies of 8.2-18 GHz vary from 2.4 to 2.3 and from 0.003 to 0.006, respectively, which is suitable for printed electronics. These findings suggest that the newly developed dielectric silica ink is cost effective and is curable at room temperature, which enables printing and curing of flexible electronic circuits in ambient conditions. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Royal Society of Chemistry | en_US |
dc.subject | Silica ink | en_US |
dc.subject | Solar cells | en_US |
dc.subject | Transistors | en_US |
dc.subject | Printed electronic circuits | en_US |
dc.title | Room temperature curable silica ink | en_US |
dc.type | Article | en_US |
Appears in Collections: | 2014 |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
2014-138.pdf Restricted Access | 1.68 MB | Adobe PDF | View/Open Request a copy |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.