Please use this identifier to cite or link to this item: http://localhost:8080/xmlui/handle/123456789/2496
Title: Preparation, Characterization and Properties of Sm2Si2O7 Loaded Polymer Composites for Microelectronic Applications
Authors: Sherin Thomas
Deepu, V
Uma, S
Mohanan, P
Philip, J
Sebastian, M T
Keywords: Composites
Polyethylene
Polystyrene
Sm2Si2O7
Substrates
Dielectric and thermal properties
Issue Date: 15-Jul-2009
Publisher: Elsevier
Citation: Materials Science and Engineering B, 163(2):67-75
Abstract: The dielectric and thermo - mechanical properties of Sm2Si2O7 filled polyethylene and polystyrene composites for microwave packaging applications are reported in this paper. The composites were synthesized by melt mixing and hot pressing methods. The effect of different volume fractions of the ceramic (vf = 0–0.5) on the dielectric properties of the composites was investigated at 1MHz and at 8 GHz. The dielectric properties (relative permittivity and dielectric loss) were found to increase with the ceramic filler content. It was observed that the addition of 0.5 vf of Sm2Si2O7 filler to polyethylene, increased the relative permittivity and the dielectric loss to 5.3 and 0.009 respectively whereas the corresponding values for the polystyrene–Sm2Si2O7 composite are 4.6 and 0.01 respectively at 8 GHz. The variation of relative permittivity with temperature in the range −25 ◦C to 60◦C was investigated for both the composites. The relative permittivities obtained experimentally were compared with that of the theoretical predictions and Effective Medium Theory was found to agree well for both the composites. The thermal conductivity, thermal expansion coefficient and Vickers micro hardness of the composites were also investigated.
URI: http://hdl.handle.net/123456789/2496
Appears in Collections:2009

Files in This Item:
File Description SizeFormat 
Preparation, characterization - Sherin Thomas - MSE B.pdf
  Restricted Access
1.63 MBAdobe PDFView/Open Request a copy


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.