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Title: | Development of electromagnetic shielding materials from the conductive blends of polystyrene polyaniline-clay nanocomposite |
Authors: | Sudha, J D Sivakala, S Kamlesh Patel Radhakrishnan Nair, P |
Keywords: | Nanostructures Rheological properties Thermo-mechanical properties Electron microscopy |
Issue Date: | 29-Jul-2010 |
Publisher: | Elsevier |
Citation: | Composites: Part A ;41:1647–1652 |
Abstract: | Electromagnetic interference shielding composite materials were developed from the conductive blends of nanostructured polyaniline-clay composite (PANICN) and Polystyrene (PS) by a one step host matrix assisted emulsion polymerization of anilinium salt of 3-pentadecyl phenol-4-sulphonic acid (3-PDPSA) in clay. 3-PDPSA was derived from cashew nut shell liquid, a low cost renewable resource based product. These blends were characterized using Uv–visible and FT-IR spectroscopy, XRD, electrical conductivity, thermal property, dielectric property and electromagnetic shielding efficiency. The interactions between the primary particles and host matrix were elucidated from the studies made through spectroscopy and rheology. The key finding of the research is that this low cost PANICNPS blend with superior electrical conductivity (7.6 10 1 S/m), excellent thermal stability and EMI SE of 10–20 dB at 8 GHz makes them as a promising candidate for application in EMI shielding and antistatic discharge matrix for the encapsulation of micro electronic devices. |
URI: | http://hdl.handle.net/123456789/2599 |
Appears in Collections: | 2010 |
Files in This Item:
File | Description | Size | Format | |
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development-sida-composites part A.pdf Restricted Access | 520.19 kB | Adobe PDF | View/Open Request a copy |
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