Microwave Dielectric Properties of Polystyrene–Forsterite (Mg2SiO4) Composite

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DC Field	Value	Language
dc.contributor.author	SASIKALA, T S	-
dc.contributor.author	SEBASTIAN, M T	-
dc.date.accessioned	2017-05-11T05:15:32Z	-
dc.date.available	2017-05-11T05:15:32Z	-
dc.date.issued	2016-11-13	-
dc.identifier.citation	Journal of ELECTRONIC MATERIALS,45 (1):729-735	en_US
dc.identifier.uri	http://hdl.handle.net/123456789/2742	-
dc.description.abstract	Polystyrene–Mg2SiO4 ceramic composites have been prepared by kneading followed by hot pressing. The dielectric properties of the composites have been investigated at both radio and microwave frequency ranges as a function of filler loading up to 50 vol.%. The dielectric constant and loss tangent increased with the ceramic filler content. The composite with 50 vol.% filler had a dielectric constant of 4.0 and loss tangent of 0.006 at 5 GHz, with Vickers microhardness of 35 HV. The coefficient of thermal expansion of the composite decreased and the thermal conductivity increased with the filler loading. PS– Mg2SiO4 composites are possible candidates for microwave substrate applications.	en_US
dc.language.iso	en	en_US
dc.publisher	spinger	en_US
dc.subject	Dielectric constant	en_US
dc.subject	electronic packaging	en_US
dc.subject	thermal conductivity	en_US
dc.subject	polystyrene	en_US
dc.subject	composite	en_US
dc.title	Microwave Dielectric Properties of Polystyrene–Forsterite (Mg2SiO4) Composite	en_US
dc.type	Article	en_US
Appears in Collections:	2016

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