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http://localhost:8080/xmlui/handle/123456789/2742| Title: | Microwave Dielectric Properties of Polystyrene–Forsterite (Mg2SiO4) Composite |
| Authors: | SASIKALA, T S SEBASTIAN, M T |
| Keywords: | Dielectric constant electronic packaging thermal conductivity polystyrene composite |
| Issue Date: | 13-Nov-2016 |
| Publisher: | spinger |
| Citation: | Journal of ELECTRONIC MATERIALS,45 (1):729-735 |
| Abstract: | Polystyrene–Mg2SiO4 ceramic composites have been prepared by kneading followed by hot pressing. The dielectric properties of the composites have been investigated at both radio and microwave frequency ranges as a function of filler loading up to 50 vol.%. The dielectric constant and loss tangent increased with the ceramic filler content. The composite with 50 vol.% filler had a dielectric constant of 4.0 and loss tangent of 0.006 at 5 GHz, with Vickers microhardness of 35 HV. The coefficient of thermal expansion of the composite decreased and the thermal conductivity increased with the filler loading. PS– Mg2SiO4 composites are possible candidates for microwave substrate applications. |
| URI: | http://hdl.handle.net/123456789/2742 |
| Appears in Collections: | 2016 |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| microvave-sasikala-journal of electronic meterials.pdf Restricted Access | 902.83 kB | Adobe PDF | View/Open Request a copy |
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