Please use this identifier to cite or link to this item: http://hdl.handle.net/123456789/3228
Title: Silver-Decorated Boron Nitride Nanosheets as an Effective Hybrid Filler in PMMA for High-Thermal-Conductivity Electronic Substrates
Authors: Abhilash, P
Nair, K S
Surendran, K P
Issue Date: 11-Dec-2017
Publisher: American Chemical Society
Citation: ACS Omega, 2(12):8825-8835
Abstract: High-thermal-conductivity and low-dielectricloss polymer nanocomposites have gained tremendous attention in microelectronics technology. Against this background, the present study deals with the development of a high-thermal-conductivity, low-dielectric-constant, and lowloss polymer nanocomposite based on silver nanoparticle (AgNP)-decorated boron nitride nanosheets (BNNSs) as the filler in poly(methyl methacrylate) (PMMA) matrix. The nanocomposites were prepared through a facile solutionblending process. Elemental mapping of the prepared nanocomposite indicates the uniform distribution of filler particle in PMMA matrix. An impressive high-thermal conductivity (TC) enhancement of around 363% was achieved for nanocomposite of 0.35 Vf of hybrid filler (1.48 W/m K) compared to pristine PMMA (0.32 W/m K). The addition of AgNP reduces the thermal contact resistance (Rc) by bridging individual BNNS, thereby improving thermal transport. Measured TC values were fitted with a theoretical model that showed good agreement. Dielectric measurements performed at radiofrequencies and microwave frequencies revealed that the nanocomposites show a low dielectric constant (<5), low loss (10−2), and very low alternating current conductivity (10−7 S/cm). The results suggest that silver-decorated BNNS is a promising hybrid filler for effective thermal management.
URI: http://10.10.100.66:8080/xmlui/handle/123456789/3228
Appears in Collections:2017

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