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Issue Date
Title
Author(s)
2010
Dielectric, thermal, and mechanical properties of CeO2-filled HDPE composites for microwave substrate applications
Anjana, P S
;
Deepu, V
;
Uma, S
;
Mohanan, P
;
Philip, J
;
Sebastian, M T
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Author
1
Anjana, P S
1
Philip, J
1
Sebastian, M T
Subject
1
Ceramic composites
1
Conductivity
1
Dielectric properties
1
Elastic-modulus
1
Epoxy-resin
1
Expansion coefficients
1
Filled polymer composites
1
Microstructure
1
Photopyroelectric technique
1
Polyethylene (PE)
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Date issued
1
2010
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