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dc.contributor.authorGuan, N-
dc.contributor.authorMendez, N A-
dc.contributor.authorKunti, A-
dc.contributor.authorBabichev, A-
dc.contributor.authorDas, S-
dc.contributor.authorKapoor, A-
dc.contributor.authorGogneau, N-
dc.contributor.authorEymery, J-
dc.contributor.authorJulien, F H-
dc.contributor.authorDurand, C-
dc.contributor.authorTchernycheva, M-
dc.date.accessioned2023-02-01T11:10:34Z-
dc.date.available2023-02-01T11:10:34Z-
dc.date.issued2020-11-16-
dc.identifier.citationNanomaterials;10(11):Article ID:2271en_US
dc.identifier.urihttps://doi.org/10.3390/nano10112271-
dc.identifier.urihttp://localhost:8080/xmlui/handle/123456789/4266-
dc.description.abstractWe analyze the thermal behavior of a flexible nanowire (NW) light-emitting diode (LED) operated under different injection conditions. The LED is based on metal–organic vapor-phase deposition (MOCVD)-grown self-assembled InGaN/GaN NWs in a polydimethylsiloxane (PDMS) matrix. Despite the poor thermal conductivity of the polymer, active nitride NWs effectively dissipate heat to the substrate. Therefore, the flexible LED mounted on a copper heat sink can operate under high injection without significant overheating, while the device mounted on a plastic holder showed a 25% higher temperature for the same injected current. The efficiency of the heat dissipation by nitride NWs was further confirmed with finite-element modeling of the temperature distribution in a NW/polymer composite membrane.en_US
dc.language.isoenen_US
dc.publisherMDPIen_US
dc.subjectnanowireen_US
dc.subjectLEDen_US
dc.subjectInGaNen_US
dc.subjectmechanical flexibilityen_US
dc.subjectself-heatingen_US
dc.titleHeat Dissipation in Flexible Nitride Nanowire Light-Emitting Diodesen_US
dc.typeArticleen_US
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