Studies on the effect of processing parameters on electroless coating of copper on boron carbide particles

Abstract

Boron carbide a hard refractory semiconductor ceramic material due to its unique structural properties and high neutron cross section finds application as structural materials and neutron shielding material. Its applicability is reduced due to low sinterbility and dispersiblity which can be overcome by copper coating. The effect of Electroless coating parameters on the surface deposits is characterised. The studies revealed that uniform and smooth coating was observed for pH11 at bath temperature of 348K. The prolonged suspension of B4C particles on the reaction bath has little effect on coating but it inturns reduces the adhesion of coating on activated particles.