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Browsing by Author "Uma, S"

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Dielectric, mechanical, and thermal properties of low-permittivity polymer-ceramic composites for microelectronic applications

Sumesh George; Anjana, P S; Sebastian, M T; Krupka, J; Uma, S; Philip, J (Wiley, 2010)

A new low-permittivity polymer-ceramic composite for packaging applications has been developed. The ceramic-reinforced polyethylene and polystyrene composites were prepared by melt mixing and hot molding techniques. Low-loss, ...
Dielectric, thermal and mechanical properties of Sr2ZnSi2O7 based polymer/ceramic composites

Tony Joseph; Uma, S; Philip, J; Sebastian, M T (Springer, 2012-06)

Polymer/Sr2ZnSi2O7 (SZS) ceramic composites suitable for substrate applications have been developed using the polymers polystyrene (PS), high density polyethylene (HDPE) and Di-Glycidyl Ether of Bisphenol A (DGEBA). The ...
Dielectric, thermal, and mechanical properties of CeO2-filled HDPE composites for microwave substrate applications

Anjana, P S; Deepu, V; Uma, S; Mohanan, P; Philip, J; Sebastian, M T (Wiley, 2010)

Cerium oxide-filled high density polyethylene (HDPE) composites for microwave substrate applications were prepared by sigma-blend technique. The HDPE was used as the matrix and the dispersion of CeO2 in the composite was ...
Electrical and thermal properties of PTFE-Sr2ZnSi2O7 composites

Joseph, T; Uma, S; Philip, J; Sebastian, M T (Springer, 2011)

A new polymer-ceramic composite was prepared using PTFE and low loss Sr2ZnSi2O7. The dielectric properties of the composite were studied in the microwave and radiofrequency ranges. The relative permittivity (epsilon(r)) ...
Preparation, Characterization and Properties of Sm2Si2O7 Loaded Polymer Composites for Microelectronic Applications

Sherin Thomas; Deepu, V; Uma, S; Mohanan, P; Philip, J; Sebastian, M T (Elsevier, 2009-07-15)

The dielectric and thermo - mechanical properties of Sm2Si2O7 filled polyethylene and polystyrene composites for microwave packaging applications are reported in this paper. The composites were synthesized by melt mixing ...
Thermal properties of low loss PTFE-CeO2 dielectric ceramic composites for microwave substrate applications

Anjana, P S; Uma, S; Philip, J; Sebastian, M T (Wiley, 2010)

Polytetrafluroethylene (PTFE) composites filled with CeO2 were prepared by powder processing technique. The PTFE is used as the matrix and the loading fraction of CeO2 in the composite varied up to 0.6 volume fraction. The ...

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