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Thermal properties of low loss PTFE-CeO2 dielectric ceramic composites for microwave substrate applications

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dc.contributor.author Anjana, P S
dc.contributor.author Uma, S
dc.contributor.author Philip, J
dc.contributor.author Sebastian, M T
dc.date.accessioned 2014-03-31T11:00:43Z
dc.date.available 2014-03-31T11:00:43Z
dc.date.issued 2010
dc.identifier.citation Journal of Applied Polymer Science 118(2):751-758;15 Oct 2010 en_US
dc.identifier.issn 0021-8995
dc.identifier.uri http://ir.niist.res.in:8080/jspui/handle/123456789/1260
dc.description.abstract Polytetrafluroethylene (PTFE) composites filled with CeO2 were prepared by powder processing technique. The PTFE is used as the matrix and the loading fraction of CeO2 in the composite varied up to 0.6 volume fraction. The thermal conductivity and coefficient of thermal expansion were studied in relation to filler concentration. The thermal conductivity increased and coefficient of thermal expansion decreased with increase in CeO2 content. For 0.6 volume fraction loading of the ceramic, the composite has a thermal conductivity of 3.1 W/m degrees C and coefficient of thermal expansion 19.6 ppm/degrees C. Different theoretical approaches have been employed to predict the effective thermal conductivity and coefficient of thermal expansion of composite systems and the results were compared with the experimental data. en_US
dc.language.iso en en_US
dc.publisher Wiley en_US
dc.subject Thermogravimetric analysis en_US
dc.subject Differential scanning calorimetry en_US
dc.subject Thermal properties en_US
dc.subject Filled polymer composites en_US
dc.subject Photopyroelectric technique en_US
dc.subject Expansion coefficients en_US
dc.subject Conductivity en_US
dc.subject Transitions en_US
dc.title Thermal properties of low loss PTFE-CeO2 dielectric ceramic composites for microwave substrate applications en_US
dc.type Article en_US


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