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HDPE Matrix Composites Filled 1 With Ca4La6(SiO4)4(PO4)2O2 2 for Microwave Substrate 3 Applications

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dc.contributor.author T, Dhanesh
dc.contributor.author M T, Sebastian
dc.date.accessioned 2016-05-12T10:45:07Z
dc.date.available 2016-05-12T10:45:07Z
dc.date.issued 2014-03
dc.identifier.citation Journal of Electronic Packaging, Transactions of the ASME 136(3)Art. No. 031002,05-May en_US
dc.identifier.uri http://hdl.handle.net/123456789/2280
dc.description.abstract Polymer–ceramic composites have been prepared by dispersing Ca4La6(SiO4)4(PO4)2O2 (CLSP) ceramic filler in high density polyethylene (HDPE) matrix through melt mixing. Scanning electron micrographs reveal the extent of filler dispersion. The dielectric properties at 1 MHz and 5 GHz have been investigated as a function of filler content. The relative permittivity increases with filler loading, maintaining a low dielectric loss. The composite with highest filler loading of 0.4 volume fraction shows a relative permittivity of 5.1 and dielectric loss of 2.3 10 3 at 5 GHz. Experimentally observed values of relative permittivity at 5 GHz have been compared with the values calculated using various theoretical models. Both the coefficient of linear thermal expansion and tensile strength have been observed to decrease with filler loading reaching a minimum value of 117 ppm/ C and 20.7 MPa, respectively, at 0.4 volume fraction of filler. The composite with maximum filler loading of 0.4 volume fraction shows the highest thermal conductivity (TC) and is 1.2W m1 K1. en_US
dc.language.iso en en_US
dc.subject dielectrics, microwave, wireless, composites 6 Introduction en_US
dc.title HDPE Matrix Composites Filled 1 With Ca4La6(SiO4)4(PO4)2O2 2 for Microwave Substrate 3 Applications en_US
dc.type Article en_US


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