Abstract:
Electromagnetic interference shielding composite materials were developed from the conductive blends of nanostructured polyaniline (PANI) and polyaniline-clay nanocomposite (PANICN) with ethylene vinyl acetate (EVA) as host matrix. Electrically conducting nanostructured PANI and PANICNs were prepared using amphiphilic dopants, 3-pentadecyl phenol 4-sulphonic acid (3-PDPSA) derived from cashew nut shell liquid, a low cost renewable resource based product and dodecyl benzene sulfonic acid (DBSA). Effects of type and quantity of conductive fillers on the electrical conductivity, mechanical properties, thermal stability, morphology and electromagnetic shielding efficiency were investigated. The presence of exfoliated nanoclay and interaction between the conductive filler–host matrix in conductive films containing PANICNs manifested from the measurement on rheological property. Films with conductive filler (∼15% loading) showed a shielding effectiveness of ∼40–80 dB at 8 GHz which makes these conducting composites potential candidate for the encapsulation as EMI shielding materials for electronic devices.
