Abstract:
This paper addresses the materials and processes for printed wiring board compatible embedded capacitor using ceramic, polymer and metal. The Ca[(Li1/3Nb2/3)0.8Ti0.2]O3−δ (CLNT)–epoxy–silver, three-phase composites were prepared by two step mixing and thermosetting technique. The dielectric properties of the three-phase composites were investigated in terms of volume fraction of silver, temperature and frequency. The dielectric properties of epoxy–CLNT composites were compared with theoretical predictions. The relative permittivity of the three-phase composites increased with silver loading. Addition of 0.28 volume fraction of silver increases the relative permittivity of epoxy–CLNT composites from 8 to 142 at 1 MHz. This composite is flexible and can be fabricated into various shapes with low processing temperature.
