Abstract:
Polystyrene–Mg2SiO4 ceramic composites have been prepared by kneading
followed by hot pressing. The dielectric properties of the composites have been
investigated at both radio and microwave frequency ranges as a function of
filler loading up to 50 vol.%. The dielectric constant and loss tangent increased
with the ceramic filler content. The composite with 50 vol.% filler had a
dielectric constant of 4.0 and loss tangent of 0.006 at 5 GHz, with Vickers
microhardness of 35 HV. The coefficient of thermal expansion of the composite
decreased and the thermal conductivity increased with the filler loading. PS–
Mg2SiO4 composites are possible candidates for microwave substrate applications.
