Abstract:
We are pleased to bring out this special issue of Transactions of the Indian Institute of Metals (TIIM) containing extended version of select papers presented at the Seventh International Conference on Solidification Science and Processing (ICSSP7) held in Thiruvananthapuram during November 19–22, 2018. ICSSP, a triennial international conference, is being organized since 2001 to allow researchers to exchange their knowledge on recent advances in the broader field of solidification. In this series, the ICSSP7 is organized jointly by the National Institute of Interdisciplinary Science and Technology (CSIR-NIIST) and Indian the Institute of Technology Madras. The conference is chaired by Professor John Banhart, Technical University, Berlin, Germany and convened by Dr. U.T.S. Pillai, CSIR-NIIST.
