Preface on International Conference on Solidification Science and Processing

dc.contributor.author	Banhart, J
dc.contributor.author	Pillai, U T S
dc.contributor.author	Rajan, T P D
dc.contributor.author	Murty, B S
dc.date.accessioned	2019-07-19T14:16:43Z
dc.date.available	2019-07-19T14:16:43Z
dc.date.issued	2018-11-02
dc.identifier.citation	Transactions of the Indian Institute of Metals; 71(11):2615–2615	en_US
dc.identifier.uri	https://link.springer.com/article/10.1007/s12666-018-1449-y
dc.identifier.uri	http://10.10.100.66:8080/xmlui/handle/123456789/3418
dc.description.abstract	We are pleased to bring out this special issue of Transactions of the Indian Institute of Metals (TIIM) containing extended version of select papers presented at the Seventh International Conference on Solidification Science and Processing (ICSSP7) held in Thiruvananthapuram during November 19–22, 2018. ICSSP, a triennial international conference, is being organized since 2001 to allow researchers to exchange their knowledge on recent advances in the broader field of solidification. In this series, the ICSSP7 is organized jointly by the National Institute of Interdisciplinary Science and Technology (CSIR-NIIST) and Indian the Institute of Technology Madras. The conference is chaired by Professor John Banhart, Technical University, Berlin, Germany and convened by Dr. U.T.S. Pillai, CSIR-NIIST.	en_US
dc.language.iso	en	en_US
dc.publisher	Springer Nature	en_US
dc.title	Preface on International Conference on Solidification Science and Processing	en_US
dc.type	Article	en_US