Editorial: Dielectric Ceramics for Electronic Applications

dc.contributor.author	Bai, Y
dc.contributor.author	Varghese, J
dc.contributor.author	Sebastian, M T
dc.date.accessioned	2023-01-30T06:03:57Z
dc.date.available	2023-01-30T06:03:57Z
dc.date.issued	2021-06-09
dc.identifier.citation	Frontiers in Materials:8	en_US
dc.identifier.uri	https://doi.org/10.3389/fmats.2021.714522
dc.identifier.uri	http://localhost:8080/xmlui/handle/123456789/4216
dc.language.iso	en	en_US
dc.publisher	Frontiers	en_US
dc.subject	dielectric	en_US
dc.subject	piezoelectric	en_US
dc.subject	cold sintering	en_US
dc.subject	upside-down composite	en_US
dc.subject	room-temperature densification	en_US
dc.subject	photo-piezoelectric	en_US
dc.title	Editorial: Dielectric Ceramics for Electronic Applications	en_US
dc.type	Article	en_US