Abstract:
The feasibility of low permittivity Sr2Al2SiO7 (SAS) ceramic filled high density polyethylene (HDPE) composites for substrate and packaging applications has been investigated in this paper. The composites were prepared by the melt mixing and hot pressing techniques. Scanning electron microscopic images of SAS filled HDPE showed the increased connectivity with filler loading. The composites showed excellent relative density (>98%) with low bulk density (<2.40 g cm−3) and very low moisture absorption (<0.10 wt%). The relative permittivity (εr) and the dielectric loss (tan δ) at 1 MHz and at 5 GHz were found to be low and found to increase with filler volume fraction (Vf). The experimentally observed relative permittivity at 5 GHz was correlated with the values proposed by different theoretical models. Among them, effective medium theory (EMT) gave better fit with experimental values except at the highest filler loading (0.50 Vf). Improvement in the thermal properties was also observed with filler content. The coefficient of linear thermal expansion (CTE) was found to decrease with filler content. Thermal conductivity (TC) of the composite was greatly enhanced as a function of filler volume fraction. The composite with 0.50 filler volume fraction showed balanced thermal and dielectric properties with εr=4.2, tan δ=3.9×10−3, TC=2.2 W m−1 K−1 and CTE=101 ppm/°C
