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Dielectric, thermal, and mechanical properties of CeO2-filled HDPE composites for microwave substrate applications
Anjana, P S
;
Deepu, V
;
Uma, S
;
Mohanan, P
;
Philip, J
;
Sebastian, M T
(
Wiley
,
2010
)
Polymer-Ceramic composites of 0-3 connectivity for circuits in electronics: A review
Sebastian, M T
;
Jantunen, H
(
Wiley
,
2010
)
Dielectric, mechanical, and thermal properties of low-permittivity polymer-ceramic composites for microelectronic applications
Sumesh George
;
Anjana, P S
;
Sebastian, M T
;
Krupka, J
;
Uma, S
;
Philip, J
(
Wiley
,
2010
)
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Author
Sebastian, M T (3)
Anjana, P S (2)
Philip, J (2)
Uma, S (2)
Deepu, V (1)
Jantunen, H (1)
Krupka, J (1)
Mohanan, P (1)
Sumesh George (1)
Subject
Epoxy-resin (3)
Microwave substrate applications (2)
Photopyroelectric technique (2)
Barium-titanate ceramics (1)
Ceramic composites (1)
Composites (1)
Conductivity (1)
Dielectric properties (1)
Elastic-modulus (1)
Electromagnetic-wave absorber (1)
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Date Issued
2010 (3)
Has File(s)
Yes (3)