Studies on the effect of processing parameters on electroless coating of copper on boron carbide particles

dc.contributor.author	Deepa, M
dc.contributor.author	Resmi, V G
dc.contributor.author	Rajan, T P D
dc.contributor.author	Pavithran, C
dc.contributor.author	Pai, B C
dc.date.accessioned	2013-11-11T08:16:14Z
dc.date.available	2013-11-11T08:16:14Z
dc.date.issued	2011
dc.identifier.citation	Transactions of the Indian Institute of Metals 64(1-2):47-51;Feb 2011	en_US
dc.identifier.issn	0972-2815
dc.identifier.uri	http://ir.niist.res.in:8080/jspui/handle/123456789/707
dc.description.abstract	Boron carbide a hard refractory semiconductor ceramic material due to its unique structural properties and high neutron cross section finds application as structural materials and neutron shielding material. Its applicability is reduced due to low sinterbility and dispersiblity which can be overcome by copper coating. The effect of Electroless coating parameters on the surface deposits is characterised. The studies revealed that uniform and smooth coating was observed for pH11 at bath temperature of 348K. The prolonged suspension of B4C particles on the reaction bath has little effect on coating but it inturns reduces the adhesion of coating on activated particles.	en_US
dc.language.iso	en	en_US
dc.publisher	Springer	en_US
dc.subject	Adhesion	en_US
dc.subject	Neutron shielding	en_US
dc.subject	Wear behavior	en_US
dc.subject	Composites	en_US
dc.title	Studies on the effect of processing parameters on electroless coating of copper on boron carbide particles	en_US
dc.type	Article	en_US